BibSLEIGH corpus
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Open Knowledge
XHTML 1.0 W3C Rec
CSS 2.1 W3C CanRec
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Travelled to:
3 × USA
Collaborated with:
S.K.Lim D.Z.Pan J.Mitra T.Song Y.Wan Y.Peng
Talks about:
reliabl (2) analysi (2) stress (2) mechan (2) chip (2) tsv (2) perspect (1) benefit (1) thermo (1) packag (1)

Person: Moongon Jung

DBLP DBLP: Jung:Moongon

Contributed to:

DAC 20142014
DAC 20122012
DAC 20112011

Wrote 3 papers:

DAC-2014-JungSWPL #3d #on the #perspective
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective (MJ, TS, YW, YP, SKL), p. 6.
DAC-2012-JungPL #3d #reliability
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs (MJ, DZP, SKL), pp. 317–326.
DAC-2011-JungMPL #3d #analysis #optimisation #reliability
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC (MJ, JM, DZP, SKL), pp. 188–193.

Bibliography of Software Language Engineering in Generated Hypertext (BibSLEIGH) is created and maintained by Dr. Vadim Zaytsev.
Hosted as a part of SLEBOK on GitHub.