Kapil Dev, Gary Woods, Sherief Reda
High-throughput TSV testing and characterization for 3D integration using thermal mapping
DAC, 2013.
@inproceedings{DAC-2013-DevWR, author = "Kapil Dev and Gary Woods and Sherief Reda", booktitle = "{Proceedings of the 50th Annual Design Automation Conference}", doi = "10.1145/2463209.2488823", isbn = "978-1-4503-2071-9", pages = "6", publisher = "{ACM}", title = "{High-throughput TSV testing and characterization for 3D integration using thermal mapping}", year = 2013, }