Travelled to:
2 × USA
Collaborated with:
S.Reda K.Dev A.N.Nowroz
Talks about:
use (2) throughput (1) character (1) techniqu (1) thermal (1) silicon (1) integr (1) improv (1) power (1) model (1)
Person: Gary Woods
DBLP: Woods:Gary
Contributed to:
Wrote 2 papers:
- DAC-2013-DevWR #3d #integration #testing #using
- High-throughput TSV testing and characterization for 3D integration using thermal mapping (KD, GW, SR), p. 6.
- DAC-2011-NowrozWR #modelling #using
- Improved post-silicon power modeling using AC lock-in techniques (ANN, GW, SR), pp. 101–106.