Navin Srivastava, Roberto Suaya, Kaustav Banerjee
High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate
DATE, 2008.
@inproceedings{DATE-2008-SrivastavaSB,
author = "Navin Srivastava and Roberto Suaya and Kaustav Banerjee",
booktitle = "{Proceedings of the 12th Conference on Design, Automation and Test in Europe}",
doi = "10.1109/DATE.2008.4484718",
isbn = "978-3-9810801-3-1",
pages = "426--431",
publisher = "{IEEE}",
title = "{High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate}",
year = 2008,
}