High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate
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Navin Srivastava, Roberto Suaya, Kaustav Banerjee
High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate
DATE, 2008.

DATE 2008
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@inproceedings{DATE-2008-SrivastavaSB,
	author        = "Navin Srivastava and Roberto Suaya and Kaustav Banerjee",
	booktitle     = "{Proceedings of the 12th Conference on Design, Automation and Test in Europe}",
	doi           = "10.1109/DATE.2008.4484718",
	isbn          = "978-3-9810801-3-1",
	pages         = "426--431",
	publisher     = "{IEEE}",
	title         = "{High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate}",
	year          = 2008,
}

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