TSV redundancy: Architecture and design issues in 3D IC
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Ang-Chih Hsieh, TingTing Hwang, Ming-Tung Chang, Min-Hsiu Tsai, Chih-Mou Tseng, Hung-Chun Li
TSV redundancy: Architecture and design issues in 3D IC
DATE, 2010.

DATE 2010
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@inproceedings{DATE-2010-HsiehHCTTL,
	author        = "Ang-Chih Hsieh and TingTing Hwang and Ming-Tung Chang and Min-Hsiu Tsai and Chih-Mou Tseng and Hung-Chun Li",
	booktitle     = "{Proceedings of the 14th Conference on Design, Automation and Test in Europe}",
	pages         = "166--171",
	publisher     = "{IEEE}",
	title         = "{TSV redundancy: Architecture and design issues in 3D IC}",
	year          = 2010,
}

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