Travelled to:
1 × France
1 × Germany
Collaborated with:
T.Hwang M.Chang M.Tsai C.Tseng H.Li
Talks about:
design (2) architectur (1) thermal (1) redund (1) memori (1) issu (1) awar (1) tsv (1) map (1)
Person: Ang-Chih Hsieh
DBLP: Hsieh:Ang=Chih
Contributed to:
Wrote 2 papers:
- DATE-2010-HsiehHCTTL #3d #architecture #design
- TSV redundancy: Architecture and design issues in 3D IC (ACH, TH, MTC, MHT, CMT, HCL), pp. 166–171.
- DATE-2009-HsiehH #3d #design #memory management
- Thermal-aware memory mapping in 3D designs (ACH, TH), pp. 1361–1366.