An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations
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Geert Eneman, J. Cho, V. Moroz, Dragomir Milojevic, M. Choi, Kristin De Meyer, Abdelkarim Mercha, Eric Beyne, Thomas Hoffmann, Geert Van der Plas
An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations
DATE, 2011.

DATE 2011
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@inproceedings{DATE-2011-EnemanCMMCMMBHP,
	author        = "Geert Eneman and J. Cho and V. Moroz and Dragomir Milojevic and M. Choi and Kristin De Meyer and Abdelkarim Mercha and Eric Beyne and Thomas Hoffmann and Geert Van der Plas",
	booktitle     = "{Proceedings of the 15th Conference on Design, Automation and Test in Europe}",
	isbn          = "978-1-61284-208-0",
	pages         = "505--506",
	publisher     = "{IEEE}",
	title         = "{An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations}",
	year          = 2011,
}

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