Travelled to:
1 × France
Collaborated with:
G.Eneman J.Cho V.Moroz D.Milojevic M.Choi K.D.Meyer A.Mercha E.Beyne G.V.d.Plas
Talks about:
configur (1) silicon (1) multipl (1) compact (1) stress (1) analyt (1) model (1) estim (1)
Person: Thomas Hoffmann
DBLP: Hoffmann:Thomas
Contributed to:
Wrote 1 papers:
- DATE-2011-EnemanCMMCMMBHP #estimation #multi
- An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations (GE, JC, VM, DM, MC, KDM, AM, EB, TH, GVdP), pp. 505–506.