Travelled to:2 × Germany
Collaborated with:S.Chang K.Wu D.Marculescu Y.Chen K.Lai Y.Shi W.Hon
Talks about:underestim (1) temperatur (1) dimension (1) constrain (1) approach (1) lifetim (1) circuit (1) between (1) variat (1) system (1)
Person: Ming-Chao Lee
DBLP: Lee:Ming=Chao
Contributed to:
20142012Wrote 2 papers:
- DATE-2014-ChenLLSHC #3d
- Yield and timing constrained spare TSV assignment for three-dimensional integrated circuits (YGC, KYL, MCL, YS, WKH, SCC), pp. 1–4.
- DATE-2012-WuLMC #approach #correlation
- Mitigating lifetime underestimation: A system-level approach considering temperature variations and correlations between failure mechanisms (KCW, MCL, DM, SCC), pp. 1269–1274.