@inproceedings{DAC-2012-AthikulwongsePL,
	author        = "Krit Athikulwongse and Mohit Pathak and Sung Kyu Lim",
	booktitle     = "{Proceedings of the 49th Annual Design Automation Conference}",
	doi           = "10.1145/2228360.2228495",
	isbn          = "978-1-4503-1199-1",
	pages         = "741--746",
	publisher     = "{ACM}",
	title         = "{Exploiting die-to-die thermal coupling in 3D IC placement}",
	year          = 2012,
}