Travelled to:
1 × France
1 × USA
Collaborated with:
S.K.Lim K.Athikulwongse J.R.Minz
Talks about:
die (2) placement (1) distribut (1) thermal (1) exploit (1) packag (1) global (1) coupl (1) rout (1) pin (1)
Person: Mohit Pathak
DBLP: Pathak:Mohit
Contributed to:
Wrote 2 papers:
- DAC-2012-AthikulwongsePL #3d
- Exploiting die-to-die thermal coupling in 3D IC placement (KA, MP, SKL), pp. 741–746.
- DATE-v2-2004-MinzPL #3d
- Net and Pin Distribution for 3D Package Global Routing (JRM, MP, SKL), pp. 1410–1411.