Dongki Kim, Sungjoo Yoo, Sunggu Lee, Jung Ho Ahn, Hyunuk Jung
A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC
DATE, 2011.
@inproceedings{DATE-2011-KimYLAJ,
author = "Dongki Kim and Sungjoo Yoo and Sunggu Lee and Jung Ho Ahn and Hyunuk Jung",
booktitle = "{Proceedings of the 15th Conference on Design, Automation and Test in Europe}",
isbn = "978-1-61284-208-0",
pages = "1333--1338",
publisher = "{IEEE}",
title = "{A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC}",
year = 2011,
}