Travelled to:
1 × France
Collaborated with:
D.Kim S.Yoo S.Lee J.H.Ahn
Talks about:
quantit (1) perform (1) benefit (1) analysi (1) stack (1) mobil (1) embed (1) die (1)
Person: Hyunuk Jung
DBLP: Jung:Hyunuk
Contributed to:
Wrote 1 papers:
- DATE-2011-KimYLAJ #3d #analysis #embedded #mobile #performance
- A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC (DK, SY, SL, JHA, HJ), pp. 1333–1338.