Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
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Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
DAC, 2011.

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@inproceedings{DAC-2011-LiuSCKKL,
	author        = "Chang Liu and Taigon Song and Jonghyun Cho and Joohee Kim and Joungho Kim and Sung Kyu Lim",
	booktitle     = "{Proceedings of the 48th Design Automation Conference}",
	doi           = "10.1145/2024724.2024900",
	isbn          = "978-1-4503-0636-2",
	pages         = "783--788",
	publisher     = "{ACM}",
	title         = "{Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC}",
	year          = 2011,
}

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