Travelled to:3 × USA
Collaborated with:S.K.Lim Y.Peng C.Liu M.Jung Y.Wan J.Cho J.Kim J.Kim
Talks about:tsv (4) optim (2) coupl (2) full (2) chip (2) perspect (1) multipl (1) extract (1) benefit (1) analysi (1)
Person: Taigon Song
DBLP: Song:Taigon
Contributed to:
201420132011Wrote 3 papers:
- DAC-2014-JungSWPL #3d #on the #perspective
- On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective (MJ, TS, YW, YP, SKL), p. 6.
- DAC-2013-SongLPL #3d #multi #optimisation
- Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs (TS, CL, YP, SKL), p. 7.
- DAC-2011-LiuSCKKL #3d #analysis #optimisation
- Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC (CL, TS, JC, JK, JK, SKL), pp. 783–788.