Travelled to:3 × USA
Collaborated with:M.Swaminathan K.Bharath K.J.Han K.Uriu T.Yamada R.Mandrekar K.Srinivasan
Talks about:system (3) packag (3) integr (3) electr (2) applic (2) power (2) interconnect (1) methodolog (1) placement (1) dimension (1)
Person: Ege Engin
DBLP: Engin:Ege
Contributed to:
200820072006Wrote 4 papers:
- DAC-2008-BharathES #algorithm #automation #search-based #using
- Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM (KB, EE, MS), pp. 560–565.
- DAC-2008-HanSE #3d #equation #modelling
- Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects (KJH, MS, EE), pp. 421–424.
- DAC-2007-BharathESUY #performance #simulation
- Computationally Efficient Power Integrity Simulation for System-on-Package Applications (KB, EE, MS, KU, TY), pp. 612–617.
- DAC-2006-MandrekarBSES #analysis
- System level signal and power integrity analysis methodology for system-in-package applications (RM, KB, KS, EE, MS), pp. 1009–1012.