Travelled to:1 × France
1 × USA
Collaborated with:M.Corbalan A.Keval D.Lisk R.Radojcic M.Nowak A.S.Arani X.Hu H.Peng C.Cheng W.Yu M.Popovich X.Chen
Talks about:challeng (1) silicon (1) reliabl (1) system (1) signal (1) integr (1) stack (1) power (1) plan (1) awar (1)
Person: Thomas Toms
DBLP: Toms:Thomas
Contributed to:
2013
2009Wrote 2 papers:
- DAC-2013-CorbalanKTLRN #3d #challenge
- Power and signal integrity challenges in 3D systems (MC, AK, TT, DL, RR, MN), p. 4.
- DATE-2009-AraniHPCYPTC #3d #reliability
- Reliability aware through silicon via planning for 3D stacked ICs (ASA, XH, HP, CKC, WY, MP, TT, XC), pp. 288–291.