Travelled to:6 × USA
Collaborated with:M.Nowak J.Corleto C.Chun M.Corbalan A.Keval T.Toms D.Lisk S.R.Nassif V.Pitchumani N.Rodriguez D.Sylvester C.Bittlestone S.Bansal J.C.Rey A.Yang M.Jang L.C.Lu P.Magarshack P.Marchal J.Cong N.S.Nagaraj R.Puri W.H.Joyner J.Burns M.Gavrielov P.Rickert H.Stork
Talks about:design (2) technolog (1) wireless (1) pathfind (1) meltdown (1) challeng (1) casualti (1) virtual (1) nanomet (1) financi (1)
Person: Riko Radojcic
DBLP: Radojcic:Riko
Contributed to:
201320102009200820062005Wrote 6 papers:
- DAC-2013-CorbalanKTLRN #3d #challenge
- Power and signal integrity challenges in 3D systems (MC, AK, TT, DL, RR, MN), p. 4.
- DAC-2010-BansalRYJLMMR #3d #question
- 3-D stacked die: now or future? (SB, JCR, AY, MSJ, LCL, PM, PM, RR), pp. 298–299.
- DAC-2009-CongNPJBGRRS #question
- Moore’s Law: another casualty of the financial meltdown? (JC, NSN, RP, WHJ, JB, MG, RR, PR, HS), pp. 202–203.
- DAC-2008-NowakCCR #design
- Holistic pathfinding: virtual wireless chip design for advanced technology and design exploration (MN, JC, CC, RR), p. 593.
- DAC-2006-NassifPRSBR #analysis #question
- Variation-aware analysis: savior of the nanometer era? (SRN, VP, NR, DS, CB, RR), pp. 411–412.
- DAC-2005-NowakR #question
- Are there economic benefits in DFM? (MN, RR), pp. 767–768.