Travelled to:1 × Germany
1 × USA
2 × France
Collaborated with:P.Vivet E.Guthmuller I.M.Panades L.Benini F.Clermidy F.Beneventi A.Bartolini F.Darve W.Lafi D.Melpignano E.Flamand B.Jego T.Lepley G.Haugou
Talks about:comput (2) embed (2) core (2) techniqu (1) platform (1) perspect (1) thermal (1) perform (1) identif (1) analysi (1)
Person: Denis Dutoit
DBLP: Dutoit:Denis
Contributed to:
20142013
20122011Wrote 4 papers:
- DATE-2014-BeneventiBVDB #analysis #identification #logic
- Thermal analysis and model identification techniques for a logic + WIDEIO stacked DRAM test chip (FB, AB, PV, DD, LB), pp. 1–4.
- DATE-2013-DutoitGP #3d #integration #power management
- 3D integration for power-efficient computing (DD, EG, IMP), pp. 779–784.
- DAC-2012-MelpignanoBFJLHCD #embedded #evaluation #framework #manycore #performance #platform #visual notation
- Platform 2012, a many-core computing accelerator for embedded SoCs: performance evaluation of visual analytics applications (DM, LB, EF, BJ, TL, GH, FC, DD), pp. 1137–1142.
- DATE-2011-ClermidyDDLV #3d #embedded #manycore
- 3D Embedded multi-core: Some perspectives (FC, FD, DD, WL, PV), pp. 1327–1332.