Travelled to:
1 × Germany
2 × USA
Collaborated with:
G.H.Loh K.V.Palem R.M.Rabbah V.J.Mooney P.Korkmaz
Talks about:
perform (2) integr (2) high (2) microarchitectur (1) microprocessor (1) processor (1) techniqu (1) arithmet (1) thermal (1) scalabl (1)
Person: Kiran Puttaswamy
DBLP: Puttaswamy:Kiran
Contributed to:
Wrote 3 papers:
- DAC-2007-PuttaswamyL #3d #scalability
- Scalability of 3D-Integrated Arithmetic Units in High-Performance Microprocessors (KP, GHL), pp. 622–625.
- HPCA-2007-PuttaswamyL #3d #architecture
- Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors (KP, GHL), pp. 193–204.
- LCTES-SCOPES-2002-PalemRMKP #design #embedded #memory management #optimisation
- Design space optimization of embedded memory systems via data remapping (KVP, RMR, VJM, PK, KP), pp. 28–37.