Travelled to:
1 × Germany
2 × France
Collaborated with:
G.D.Micheli C.Zhang H.Xu K.Siozios D.Soudris
Talks about:
interconnect (1) architectur (1) methodolog (1) transfer (1) thermal (1) support (1) softwar (1) silicon (1) analysi (1) voltag (1)
Person: Vasilis F. Pavlidis
DBLP: Pavlidis:Vasilis_F=
Contributed to:
Wrote 3 papers:
- DATE-2012-ZhangPM #3d #analysis #grid #power management
- Voltage propagation method for 3-D power grid analysis (CZ, VFP, GDM), pp. 844–847.
- DATE-2011-XuPM
- Analytical heat transfer model for thermal through-silicon vias (HX, VFP, GDM), pp. 395–400.
- DATE-2009-SioziosPS #3d #architecture
- A software-supported methodology for exploring interconnection architectures targeting 3-D FPGAs (KS, VFP, DS), pp. 172–177.