Travelled to:
3 × USA
Collaborated with:
S.Kang Y.Cheng E.Rosenbaum L.Yuan A.Dharchoudhury J.Lu P.Chen C.Chang L.Sha D.J.Huang C.Cheng
Talks about:
diagnosi (2) reliabl (2) vlsi (2) chip (2) interconnect (1) electrostat (1) electromigr (1) placement (1) sequenti (1) nesterov (1)
Person: Chin-Chi Teng
DBLP: Teng:Chin=Chi
Contributed to:
Wrote 4 papers:
- DAC-2014-LuCCSHTC #named #using
- ePlace: Electrostatics Based Placement Using Nesterov’s Method (JL, PC, CCC, LS, DJHH, CCT, CKC), p. 6.
- DAC-1997-YuanTK #estimation #statistics
- Statistical Estimation of Average Power Dissipation in Sequential Circuits (LPY, CCT, SMK), pp. 377–382.
- DAC-1996-ChengTDRK #named #reliability
- iCET: A Complete Chip-Level Thermal Reliability Diagnosis Tool for CMOS VLSI Chips (YKC, CCT, AD, ER, SMK), pp. 548–551.
- DAC-1996-TengCRK #reliability
- Hierarchical Electromigration Reliability Diagnosis for VLSI Interconnects (CCT, YKC, ER, SMK), pp. 752–757.