Travelled to:
1 × Germany
1 × USA
2 × France
Collaborated with:
L.Benini F.Poletti D.Bertozzi D.Porcarelli D.Balsamo D.Brunelli P.Marchal D.Atienza P.G.D.Valle G.D.Micheli J.M.Mendias
Talks about:
low (3) swing (2) power (2) chip (2) temperatur (1) residenti (1) processor (1) framework (1) techniqu (1) industri (1)
Person: Giacomo Paci
DBLP: Paci:Giacomo
Contributed to:
Wrote 4 papers:
- DATE-2013-PorcarelliBBP #industrial #low cost #monitoring
- Perpetual and low-cost power meter for monitoring residential and industrial appliances (DP, DB, DB, GP), pp. 1155–1160.
- DATE-2009-PaciBB #adaptation #bias #communication #effectiveness #variability
- Effectiveness of adaptive supply voltage and body bias as post-silicon variability compensation techniques for full-swing and low-swing on-chip communication channels (GP, DB, LB), pp. 1404–1409.
- DAC-2006-AtienzaVPPBMM #framework #multi #performance
- A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip (DA, PGDV, GP, FP, LB, GDM, JMM), pp. 618–623.
- DATE-2006-PaciMPB #design #power management
- Exploring “temperature-aware” design in low-power MPSoCs (GP, PM, FP, LB), pp. 838–843.