Travelled to:
2 × Germany
Collaborated with:
M.Coppola V.Pasca L.Anghel C.Rusu A.Deledda C.Mucci A.Vitkovski P.Bonnot A.Grasset P.Millet M.Kühnle F.Ries M.Hübner J.Becker L.Pieralisi G.Maruccia F.Campi T.DeMarco
Talks about:
communic (2) die (2) infrastructur (1) reconfigur (1) spidergon (1) processor (1) heterogen (1) resili (1) design (1) stnoc (1)
Person: Riccardo Locatelli
DBLP: Locatelli:Riccardo
Contributed to:
Wrote 2 papers:
- DATE-2010-PascaARLC #3d #communication #fault
- Error resilience of intra-die and inter-die communication with 3D spidergon STNoC (VP, LA, CR, RL, MC), pp. 275–278.
- DATE-2008-DeleddaMVBGMKRHBCPLMCD #communication #configuration management #design #framework
- Design of a HW/SW Communication Infrastructure for a Heterogeneous Reconfigurable Processor (AD, CM, AV, PB, AG, PM, MK, FR, MH, JB, MC, LP, RL, GM, FC, TD), pp. 1352–1357.