Travelled to:3 × Germany
Collaborated with:L.Pieralisi M.Caldari M.Conti C.Turchetti R.Locatelli V.Pasca L.Anghel C.Rusu S.Curaba P.Crippa S.Orcioni A.Deledda C.Mucci A.Vitkovski P.Bonnot A.Grasset P.Millet M.Kühnle F.Ries M.Hübner J.Becker G.Maruccia F.Campi T.DeMarco
Talks about:communic (2) system (2) level (2) amba (2) die (2) bus (2) infrastructur (1) architectur (1) reconfigur (1) methodolog (1)
Person: Massimo Coppola
DBLP: Coppola:Massimo
Contributed to:
201020082003Wrote 4 papers:
- DATE-2010-PascaARLC #3d #communication #fault
- Error resilience of intra-die and inter-die communication with 3D spidergon STNoC (VP, LA, CR, RL, MC), pp. 275–278.
- DATE-2008-DeleddaMVBGMKRHBCPLMCD #communication #configuration management #design #framework
- Design of a HW/SW Communication Infrastructure for a Heterogeneous Reconfigurable Processor (AD, CM, AV, PB, AG, PM, MK, FR, MH, JB, MC, LP, RL, GM, FC, TD), pp. 1352–1357.
- DATE-2003-CaldariCCCOPT #analysis
- System-Level Power Analysis Methodology Applied to the AMBA AHB Bus (MC, MC, MC, PC, SO, LP, CT), pp. 20032–20039.
- DATE-2003-CaldariCCCPT #architecture #modelling #transaction #using
- Transaction-Level Models for AMBA Bus Architecture Using SystemC 2.0 (MC, MC, MC, SC, LP, CT), pp. 20026–20031.