48 papers:
CASE-2015-BrundageCALH- Evaluating and reducing production impact on HVAC cooling load (MPB, QC, JA, JL, TH), pp. 212–217.
DAC-2015-PanthSDL #3d #clustering #mobile #power management #trade-off- Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications (SP, KS, YD, SKL), p. 6.
DATE-2015-ConficoniBTTB #energy- Energy-aware cooling for hot-water cooled supercomputers (CC, AB, AT, GT, LB), pp. 1353–1358.
STOC-2015-CousinsV #algorithm- Bypassing KLS: Gaussian Cooling and an O^*(n3) Volume Algorithm (BC, SV), pp. 539–548.
CSCW-2015-BakhshiKS #comprehension #online #question- Understanding Online Reviews: Funny, Cool or Useful? (SB, PK, DAS), pp. 1270–1276.
ASPLOS-2015-GoiriNB #for free #named- CoolAir: Temperature- and Variation-Aware Management for Free-Cooled Datacenters (IG, TDN, RB), pp. 253–265.
- CASE-2014-HatanoDW
- A Cooling and Heat-retention System actuated by Peltier device considering fan-motor control (TH, MD, SW), pp. 164–169.
- CASE-2014-KhodabakhshianFW #performance #predict
- Predictive control of the engine cooling system for fuel efficiency improvement (MK, LF, JW), pp. 61–66.
- DATE-2014-FourmigueBN #3d #performance #simulation
- Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias (AF, GB, GN), pp. 1–6.
- DATE-2014-SabrySARM #generative
- Integrated microfluidic power generation and cooling for bright silicon MPSoCs (MMS, AS, DA, PR, BM), pp. 1–6.
DUXU-DP-2014-FarnsworthHHP #data-driven- Cool in Business: Developing a Data-Based Instrument Measuring “Cool” (CF, KH, TH, SP), pp. 232–243.
- HCI-AIMT-2014-VaidyanathanR #case study #comparative #gesture #interactive #using
- “Will Use It, Because I Want to Look Cool” A Comparative Study of Simple Computer Interactions Using Touchscreen and In-Air Hand Gestures (VV, DR), pp. 170–181.
IJCAR-2014-GorinPSWW #algebra #hybrid #logic #named- Cool — A Generic Reasoner for Coalgebraic Hybrid Logics (System Description) (DG, DP, LS, FW, TW), pp. 396–402.
- CASE-2013-YanLS #detection #fault #process #statistics
- Fault detection of cooling coils based on unscented Kalman filters and statistical process control (YY, PBL, BS), pp. 237–242.
- DATE-2013-FourmigueBN #3d #simulation
- Explicit transient thermal simulation of liquid-cooled 3D ICs (AF, GB, GN), pp. 1385–1390.
- DATE-2013-XieYPSC #adaptation
- Adaptive thermal management for portable system batteries by forced convection cooling (QX, SY, MP, DS, NC), pp. 1225–1228.
ICEIS-J-2013-NganBEB13a #capacity #energy #framework #optimisation- Optimizing Power, Heating, and Cooling Capacity on a Decision-Guided Energy Investment Framework (CKN, AB, NEE, EB), pp. 154–173.
- ICEIS-v1-2013-NganBEB #capacity #energy #framework
- A Decision-Guided Energy Framework for Optimal Power, Heating, and Cooling Capacity Investment (CKN, AB, NEE, EB), pp. 357–369.
- DATE-2012-SabrySA #3d #using
- Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation (MMS, AS, DA), pp. 599–604.
LDTA-2012-LinckeS #concept #higher-order #object-oriented- From HOT to COOL: transforming higher-order typed languages to concept-constrained object-oriented languages (DL, SS), p. 3.
HPCA-2012-AyoubNR #cpu #energy #memory management #named- JETC: Joint energy thermal and cooling management for memory and CPU subsystems in servers (RZA, RN, TR), pp. 299–310.
- DAC-2011-KumarT #realtime
- Cool shapers: shaping real-time tasks for improved thermal guarantees (PK, LT), pp. 468–473.
- DATE-2011-SabrySATLSBTBM #3d #design #towards
- Towards thermally-aware design of 3D MPSoCs with inter-tier cooling (MMS, AS, DA, YT, YL, SS, NB, JRT, TB, BM), pp. 1466–1471.
- CASE-2010-WangBHMFS
- Integrated management of cooling resources in air-cooled data centers (ZW, CB, CH, AAM, CJF, RS), pp. 762–767.
- CASE-2010-ZhangWPTCPJ #analysis
- Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling (TZ, JTW, YP, TT, JYC, RP, MKJ), pp. 750–755.
- DAC-2010-LongM #framework #optimisation
- A framework for optimizing thermoelectric active cooling systems (JL, SOM), pp. 591–596.
- DAC-2010-NsBNPSGB #design #future of #power management #question #what
- What’s cool for the future of ultra low power designs? (NN, JB, KN, VP, TS, AG, SB), pp. 523–524.
- DATE-2010-AyoubSR #multi #named #scheduling
- GentleCool: Cooling aware proactive workload scheduling in multi-machine systems (RZA, SS, TSR), pp. 295–298.
- DATE-2010-CoskunARBM #3d #architecture #energy
- Energy-efficient variable-flow liquid cooling in 3D stacked architectures (AKC, DA, TSR, TB, BM), pp. 111–116.
- DATE-2010-LeupersTNKWI #programming
- Cool MPSoC programming (RL, LT, XN, BK, MW, TI), pp. 1488–1493.
- DATE-2010-LongMG #optimisation
- Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers (JL, SOM, MG), pp. 117–122.
- DATE-2010-SarnoT #integration
- Integration, cooling and packaging issues for aerospace equipments (CS, CT), pp. 1225–1230.
- ASPLOS-2010-AhmadV #maintenance #optimisation
- Joint optimization of idle and cooling power in data centers while maintaining response time (FA, TNV), pp. 243–256.
- DATE-2009-TzengH #named
- QC-Fill: An X-Fill method for quick-and-cool scan test (CWT, SYH), pp. 1142–1147.
- DAC-2008-PuriVEWFYK #problem #question
- Keeping hot chips cool: are IC thermal problems hot air? (RP, DV, DE, AJW, PDF, AY, SVK), pp. 634–635.
- DAC-2006-YangCBDSK #question
- Entering the hot zone: can you handle the heat and be cool? (AY, RC, SB, JAD, SS, UK), pp. 174–175.
- DAC-2005-PuriSB
- Keeping hot chips cool (RP, LS, SB), pp. 285–288.
ITiCSE-2002-Nygaard #learning #object-oriented- COOL (comprehensive object-oriented learning) (KN), p. 218.
SAC-2002-AvdicausevicMLZ #aspect-oriented- Experimental aspect-oriented language — AspectCOOL (EA, MM, ML, VZ), pp. 943–947.
- ASPLOS-2002-AshokCM #energy #memory management #named #performance
- Cool-Mem: combining statically speculative memory accessing with selective address translation for energy efficiency (RA, SC, CAM), pp. 133–143.
- HCI-CCAD-1999-NabeshimaTSNIOKS #hybrid #monitoring
- Hybrid monitoring system for high temperature gas cooling reactor (KN, ET, TS, SN, KI, TO, KK, KS), pp. 1187–1191.
- HCI-EI-1999-Hollnagel #interface
- Keep Cool: The Value of Affective Computer Interfaces in a Rational World (EH), pp. 676–680.
PLDI-1998-FlattF #named- Units: Cool Modules for HOT Languages (MF, MF), pp. 236–248.
CC-1998-BraunKK #analysis #control flow #generative #named- Cool: A Control-Flow Generator for System Analysis (VB, JK, DK), pp. 306–309.
PPoPP-1993-ChandraGH #locality- Data Locality and Load Balancing in COOL (RC, AG, JLH), pp. 249–259.
TOOLS-USA-1991-LeaW #approach #distributed #object-oriented- Supporting Object-Oriented Languages in a Distributed Environment: The COOL Approach (RL, JW), pp. 37–48.
OOPSLA-ECOOP-1990-HabertA #kernel #named #object-oriented- COOL: Kernel Support for Object-Oriented Environments (SH, VA), pp. 269–277.
- DAC-1986-LigthartAB #statistics #using
- Design-for-testability of PLA’s using statistical cooling (MML, EHLA, FPMB), pp. 339–345.
